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7. Die Attach Conductive Silver Adhesive

Create: 09/09/2019
Expired Date:09/30/2028
Category: Adhesive [Chemical]
Message:SECrosslink-6261 high thermal conductivity, high electrical conductivity, low ion content, single component, high temperature resistance, shock resistance, used for chip bonding. Brand SECrosslink Type SECrosslink-6261 Curing condition 200 ℃/40 min ECA types Nano-silver Silver content 92% Viscosity 32000CPS Thermal conductivity 150 w/m•K Shearing strength 35MPa Silver content 91% Application Die attach Appearance Silver gray Usage temperature -30 - 400℃
City:Shanghai[CN] 
Location:
 
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